Connection apparatus for circuit board, ink jet type recording apparatus using the same, ic chip and ink cartridge having ic chip

ABSTRACT

A circuit board on an ink cartridge has contact pads which are electrically conducted to a semiconductor storage element mounted on the circuit board. Connector terminals on an ink jet recording apparatus are brought into relative slide contact with a surface of this circuit board, and electrically connected to the contact pads. When the connector terminals come in contact with the contact pads, the dust adhering to the connector terminals is wiped and removed by step portions that are constituted by no-resist-film formation parts and that are adjacent to the contact pads. Consequently, the reliability of the electrical contact between the connector terminals and the contact pads is ensured.

This is a continuation of application Ser. No. 11/484,773 filed Jul. 12,2006, which is a divisional of application Ser. No. 10/206,818 filedJul. 29, 2002, which claims priority from Japanese Patent P2001-229938filed Jul. 30, 2001, the disclosure of which is incorporated herein byreference. The entire disclosure of the prior applications, applicationSer. No. 10/206,818 and No. 11/484,773 are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

This invention relates to a connection apparatus for a circuit boardconfigured so that connector terminals come in relative slide contactwith contact pads formed on a circuit board surface from a direction ofa surface of the circuit board and electrically conducted thereto, andalso relates to an ink jet type recording apparatus using thisconnection apparatus for a circuit board. The present invention furtherrelates to an IC chip (a circuit board) having contact pads and a memorydevice on a base (a substrate), and to an ink cartridge having the ICchip.

For example, an ink jet type recording apparatus is configured so that aplurality of ink cartridges to be used therefor are detachably supportedby a cartridge holder and that ink of each color is supplied to arecording head. Recently, there have been provided products of such akind of a recording apparatus, which are configured so that informationon the kind, color, and remaining amount of ink contained in each of theink cartridges is held at the corresponding ink cartridge, and that theaforementioned information is transferred between a main unit of therecording apparatus and each of the ink cartridges to thereby achieveproper management of a printing operation.

Therefore, the ink cartridge has a circuit board (an IC chip) on which,for instance, a semiconductor storage device (a memory device) beingcapable of storing the aforementioned information is mounted. In thecase that the ink cartridges are loaded in a cartridge holder, therecording apparatus employs a connection apparatus for the circuitboard, which is electrically connected between the main unit and each ofthe ink cartridges of the recording apparatus to thereby enable thetransfer of the information therebetween.

FIGS. 10A and 10B (10C) illustrate an example of a circuit board, whichis used in the aforementioned recording apparatus. FIG. 10A is a planview illustrating a state of the circuit board mounted on the inkcartridge, which is taken from above the top surface thereof. FIG. 10B(10C) is an enlarged sectional view illustrating a state of the circuitboard shown in FIG. 10A, which is taken in the direction of arrows fromline C-C.

A base (a substrate) 61 of the circuit board 27 is constituted by, forexample, a glass epoxy resin board, on the surface of which a pluralityof contact pads 62 slide-contacted with and electrically conducted toconnector terminals (to be described) are formed. Further, solder resistfilm 63 is applied over the entire surface thereof with the exception ofplaces, at which the contact pads 62 are formed. FIG. 10B shows a casewhere a minute clearance is formed between an edge of the solder resistfilm 63 and an edge of the contact pad 62, whereas FIG. 10C shows a casewhere the edge of the solder resist film 63 is overlaid on the edge ofthe contact pad 62.

As a result of applying this resist film 63 thereon, circuit patterns(not shown) conducted to the contact pads 62 and formed on the circuitboard are coated with the resist film 63. Thus, when the circuit board27 come in relative slide contact with a plurality of connectorterminals (to be described later), an occurrence of the electricalconduction between the circuit pattern and each of the connectorterminals can be prevented. Thus, this recording apparatus prevents anoccurrence of a problem that the information or data is destructed byapplying an unnecessary drive voltage from the connector terminals tothe circuit patterns formed on the circuit board 27 or byshort-circuiting the circuit patterns through the connector terminals.

FIG. 11 illustrates a state in which the connector terminals areslide-contacted with the circuit board 27. A semiconductor storageelement (a memory device) 65, for instance, EEPROM is mounted on therear surface of the circuit board 27, and electrically connected to thecontact pads 62 through the aforementioned circuit patterns and throughholes (not shown). Further, the semiconductor storage element 65 isfixed to the rear surface of the circuit board 27 by a mold resin 66.The circuit board 27 is attached to an end portion of a casing formedfrom a synthetic resin, which constitutes an outer part of the inkcartridge, in such a way as to place the contact pads 62 on the surfacethereof. This circuit board 27 is mounted in a concave portion 67 formedin the end portion of the casing to thereby perform the positioning ofthe circuit board 27.

Furthermore, when the ink cartridge is loaded into the cartridge holder,the circuit board 27 is adapted so that a connector terminal 70 formedfrom an elastic metal material placed in the cartridge holder comes inrelative slide contact with the circuit board 27 from the direction ofthe surface of the circuit board 27 in such a way as to cause theconnector terminal 70 having a curved end portion to come in contactwith the pad 62 provided on the circuit board 27. That is, the circuitboard 27 advances in the direction of an arrow D shown in FIG. 11. Thus,the connector terminals 70 are respectively brought into contact withthe pads 62 formed on the circuit board 27 and electrically conductedthereto.

Further, a projecting part 68 projecting in the direction of the topsurface of the circuit board 27 is formed at a position, at which thecircuit board 27 is mounted, on the end portion of the casing. This isperformed so as to prevent the end portion of the circuit board 27 fromcoming in contact with the connector terminals 70. That is, the base 61of the circuit board 27 is formed like a plate from a glass epoxy resin.This material has a problem that when the connector terminals 70directly touches the end portion, the glass material chips and thus, thecircuit board 27 is damaged. Consequently, the apparatus is deliberatelyconfigured so that the end portion of the circuit board 27 does nottouch the connector terminals 70.

When the connector terminal 70 is slid on the circuit board 27 and thenelectrically connected to the pad 62 of the circuit board 27, dust orthe like, which exists on the sliding contact path, may be adhered tothe connector terminal 70 and intervene between the connector terminal70 and the pad 62.

In this case, the contact between the pad 62 and the connector terminal70 becomes insufficient. This disables operations of reading data fromand writing data to the semiconductor storage element 65 mounted on thecircuit board 27. Thus, in the case of utilizing the apparatus of thisconfiguration in managing the ink cartridges in the ink jet typerecording apparatus, obstacles, such as disablement of normal printingoperation of the recording apparatus, occur.

Further, in the case where the projecting portion is formed on thecircuit board mounting portion at the end of the circuit board, theconnector terminals 70 override the projecting part 68 and then come incontact with the surface of the circuit board 27. Since the circuitboard 27 advances in the direction of the arrow D. the end portions ofthe connector terminals 70 are brought into contact with the surfaces ofthe pads 62 formed on the circuit board 72. Therefore, when theconnector terminal 70 overrides the projecting part 68, the surface ofthe projecting part 68 formed from, for instance, a synthetic resin issubject to friction caused by the connector terminal 70, and thusundergoes an action by which the material is worn.

Also, in this case, the resin material becomes floury dust and adheresto the connector terminal 70. Then, such dust intervenes between the pad62 and the connector terminal 70.

SUMMARY OF THE INVENTION

This invention is accomplished by focusing attention to theaforementioned problems. Accordingly, an object of the invention is toprovide a connection apparatus for a circuit board, which is enabled toprevent an occurrence of long-term electrical poor contacting. Moreover,another object of the invention is to provide an ink jet type recordingapparatus enabled to ensure proper printing operation over a long timeperiod. Yet another object of the invention is to provide an IC chiphaving a structure that can eliminate the aforementioned problems. Stillanother object of the invention is to provide an ink cartridge having anIC chip that can eliminate the aforementioned problems.

To achieve the foregoing objects, according to an aspect of thisinvention, there is provided a connection apparatus for a circuit board,which is configured so that a contact pad electrically conducted tocircuit patterns arranged on a circuit board is formed on a circuitboard surface of the circuit board, and that a connector terminal formedfrom an elastic metal material is in contact with the contact pad bybeing in relative slide contact with said contact pad from a directionof a circuit board surface of said circuit board. In this connectionapparatus, a projecting part for preventing an end portion of thecircuit board from coming in contact with the connector terminal isdisposed adjacently to the end portion of the circuit board. A stepportion is formed on a slide contact path of the connector terminalbetween the end portion of the circuit board and the contact pad so thatthe step portion elastically deforms the connector terminal to riserelative to the circuit board surface.

In this case, preferably, the step portion is formed from metal foil.Further, a preferred embodiment of the invention is configured so thatthe step portion is formed between a base of the circuit board and asurface of the contact pad. Additionally, preferably, the circuit boardis coated with solder resist film with the exception of a place wherethe contact pad is formed, and a portion that is on the slide contactpath of the connector terminal and that is adjacent to the contact pad.

With such a configuration, the end portion of the connector terminaloverrides the projecting part and then comes in relative slide contactwith the top surface of the resist film formed on the circuit boardsurface. Subsequently, the end portion falls onto a no-resist-filmformation part placed nearest to the contact pad. Finally, the endportion runs upon the top surface of the contact pad, so that theconnector terminal is brought into contact with the contact pad. Whenthe connector terminal finally runs upon the top surface of the contactpad, the dust adhering to the connector terminal is wiped and removed bythe step portion formed owing to the thickness of the contact pad at thefront end part of the contact pad by the action of such asliding-contact operation.

Therefore, the frequency of causing dust to intervene between thecontact pad and the connector terminal can be reduced. The reliabilityof the electrical contact between the connector terminal and the contactpad can be ensured. Further, the effect of wiping the dust adhering tothe connector terminal can be enhanced because the step portion isconstituted by metal foil that constitutes the contact pad.

Meanwhile, another preferred embodiment of this invention is configuredso that the step portion is formed between the base of the circuit boardand the surface of the dummy pattern. In this case, it is desirable thatthe dummy pattern is insulated from the circuit patterns arranged on thecircuit board. Additionally, the dummy patterns separate from oneanother and correspondingly to the plural connector terminals arepreferably employed on the path of the connector terminals coming inslide contact with the contact pads. Furthermore, in each of theaforementioned configurations, preferably, the circuit board is coatedwith solder resist film so as not to cover the contact pads and portionsadjacent to the contact pads on the slide contact path of the connectorterminals.

In the case of employing such a configuration, the end portion of theconnector terminal overrides the projecting part and then comes in slidecontact with the circuit board surface. Subsequently, the end portionruns upon the top surface of the dummy pattern formed from metallicfoil. Then, the end portion comes in slide contact with the top surfaceof the resist film. Finally, the end portion comes in contact with thetop surface of the contact pad. When the connector terminal runs uponthe top surface of the dummy pattern, the dust adhering to the connectorterminal is wiped by the step portion formed owing to the thickness ofthe dummy pattern at the front end part of the dummy pattern by theaction of such a sliding-contact operation. Therefore, the frequency ofcausing dust to intervene between the contact pad and the connectorterminal can be reduced. The reliability of the electrical contactbetween the connector terminal and the contact pad can be ensured.

Furthermore, to achieve the foregoing objects, according to anotheraspect of the invention, there is provided an ink jet type recordingapparatus configured so that a signal is transferred between a main unitof a recording apparatus and a circuit board mounted on an ink cartridgein a state in which the circuit board is mounted on the ink cartridge,and in which the connector terminal is disposed in a cartridge holderdetachably supporting the ink cartridge.

In this case, preferably, the ink jet type recording apparatus isconfigured so that a readable/writable semiconductor storage element ismounted on the circuit board, and that information on the ink cartridgeloaded in the cartridge holder is read from and written to thesemiconductor storage element.

According to the ink jet type recording apparatus of the aforementionedconfiguration, the operations and effects of the aforementionedconnection apparatus for a circuit board can be obtained. Moreover,information on the cartridge can be accurately transferred between thecartridge and the main unit of the recording apparatus. Therefore,proper printing operation of the recording apparatus can be assured. Thereliability of an operation of such a kind of an ink jet type recordingapparatus can be ensured.

The present invention further provides the following arrangements:

-   -   (1) An IC chip comprising:    -   a substrate;    -   a contact pad on a first surface of the substrate;    -   a resist film portion on the first surface of the substrate;    -   a memory device on a second, opposite surface of the substrate,        the memory device being electrically connected to the contact        pad;    -   a non-resist film portion exposing the first surface of the        substrate, and being located in a first side of the contact pad        in a surface direction of the substrate, wherein    -   the non-resist film portion and the contact pad define a step        therebetween;    -   the contact pad and the resist film portion form a clearance        therebetween in a second, opposite side of the contact pad in        the surface direction of the substrate;    -   a length of the non-resist portion in the surface direction of        the substrate is larger than a length of the clearance in the        surface direction of the substrate.    -   (2) The IC chip according to (1), wherein:    -   a plurality of said contact pads are disposed to form a        staggered arrangement; and    -   a plurality of said non-resist film portions are formed        correspondingly to said contact pads to form a staggered        arrangement.    -   (3) The IC chip according to (2), wherein said contact pads are        arrayed into two rows, and a width of one row is longer than a        width of the other row.    -   (4) The IC chip according to (3), wherein said non-resist film        portions are arrayed into two rows, and the non-resist film        portions of one row and the contact pads of the one row are        alternately arranged on a straight line parallel to a direction        of the rows.    -   (5) The IC chip according to (1), wherein a height of the step        portion is equal to a thickness of the contact pad.    -   (6) The IC chip according to (1), wherein a surface of the        contact pad is substantially flush with a surface of the resist        film portion.    -   (7) The IC chip according to (1), further comprising:    -   a second resist film portion on the first surface of the        substrate, and being located in the first side of the contact        pad in the surface direction of the substrate, wherein the        non-resist portion is interposed between the second resist film        portion and the contact pad in the surface direction of the        substrate.    -   (8) An IC chip comprising:    -   a substrate;    -   a contact pad on a first surface of the substrate;    -   a resist film portion on the first surface of the substrate;    -   a memory device on a second, opposite surface of the substrate,        the memory device being electrically connected to the contact        pad;    -   a dummy pattern on the first surface of the substrate;    -   a non-resist film portion exposing the first surface of the        substrate, and being located opposite from the contact pad with        respect to the dummy pattern in a surface direction of the        substrate, wherein    -   the non-resist film portion and the dummy pattern define a step        therebetween;    -   the contact pad and the resist film portion form a clearance        therebetween in the surface direction of the substrate;    -   a length of the non-resist portion in the surface direction of        the substrate is larger than a length of the clearance in the        surface direction of the substrate.    -   (9) The IC chip according to (8), wherein:    -   a plurality of said contact pads are disposed to form a        staggered arrangement; and    -   a single of said dummy pattern is formed correspondingly to all        of said contact pads.    -   (10) The IC chip according to (8), wherein:    -   a plurality of said contact pads are disposed to form a        staggered arrangement; and    -   a plurality of said dummy patterns separated one from another        are formed correspondingly to said contact pads to form a        staggered arrangement.    -   (11) The IC chip according to (9), wherein said contact pads are        arrayed into two rows, and a width of one row is longer than a        width of the other row.    -   (12) The IC chip according to (10), wherein said contact pads        are arrayed into two rows, and a width of one row is longer than        a width of the other row.    -   (13) The IC chip according to (8), wherein a height of the step        portion is equal to a thickness of the dummy pattern.    -   (14) The IC chip according to (8), wherein a surface of the        contact pad is substantially flush with a surface of the resist        film and a surface of the dummy pattern.    -   (15) The IC chip according to (8), further comprising:    -   a second resist film portion on the first surface of the        substrate, wherein the second resist film portion is interposed        between the dummy pattern and the contact pad in the surface        direction of the substrate.    -   (16) An ink cartridge comprising:    -   a housing having a recessed portion;    -   the IC chip recited in any one of (1) to (15) and attached to        the recessed portion.    -   (17) The ink cartridge according to (16), further comprising:    -   a projecting portion on the housing and adjacent to the recessed        portion, wherein:    -   the projecting portion is located opposite from the contact pad        with respect to the non-resist film portion in the surface        direction of the substrate, and    -   the projecting portion extends beyond the contact pad in a        direction perpendicular to the surface direction of the        substrate.    -   (18) An ink jet recording apparatus comprising:    -   a carriage having a connector terminal;    -   an ink cartridge mountable onto the carriage, the ink cartridge        including:        -   a housing having a recessed portion;        -   the IC chip recited in any one of (1) to (15) and attached            to the recessed portion, wherein:    -   when the ink cartridge is mounted onto the carriage, the        connector terminal is electrically connected to the contact pad        after the connector terminal is slidingly contacted with the        first surface of the substrate through the non-resist film        portion and wiped by the step portion.    -   (19) An ink jet recording apparatus comprising:    -   a carriage having a connector terminal;    -   an ink cartridge mountable onto the carriage, the ink cartridge        including:        -   a housing;        -   an IC chip attached to the housing, the IC chip having:        -   a substrate;        -   a contact pad on a first surface of the substrate;        -   a recessed portion on the first surface of the substrate,            wherein the recessed portion has a bottom recessed relative            to a surface of the contact pad and defines a step portion            at an edge of the bottom;    -   when the ink cartridge is mounted onto the carriage, the        connector terminal is electrically connected to the surface of        the contact pad after the connector terminal is slidingly        contacted with the bottom of the recessed portion and wiped by        the step portion.    -   (20) The ink jet recording apparatus according to (19), wherein        the recessed portion is adjacent to the contact pad, and the        step portion is defined between the contact pad and the recessed        portion.    -   (21) The ink jet recording apparatus according to (19), further        comprising:    -   a dummy pattern on the first surface of the substrate and        adjacent to the recessed portion, wherein the step is defined        between the dummy pattern and the recessed portion.    -   (22) The ink jet recording apparatus according to (19), further        comprising:    -   a memory device located on a second, opposite surface of the        substrate and electrically connected to the contact pad.    -   (23) The ink jet recording apparatus according to (19), wherein        the recessed portion is formed by exposing a part of the first        surface of the substrate without applying a resist film onto        that part.    -   (24) A circuit board comprising:    -   a substrate;    -   a contact pad formed on a first surface of the substrate, and to        be connected to a connector terminal by coming in sliding        contact with the connector terminal; and    -   a step portion formed by the first surface and the contact pad,        and located at an upstream side of the contact pad in a        direction in which the connector terminal is connected to the        contact pad.    -   (25) A circuit board comprising:    -   a substrate;    -   a contact pad formed on a first surface of the substrate, and to        be connected to a connector terminal by coming in sliding        contact with the connector terminal;    -   a dummy pattern formed on the first surface, and at least        partially aligned with the contact pad along a direction in        which the connector terminal is connected to the contact pad;        and    -   a step portion formed by the first surface and the dummy        pattern, and located at an upstream side of the contact pad in        the direction in which the connector terminal is connected to        the contact pad.    -   (26) The circuit board according to (24) or (25), further        comprising:    -   a resist film portion on the first surface; and    -   a non-resist film portion having the step portion.    -   (27) The circuit board according to (24), wherein    -   a plurality of the contact pads are disposed to form a staggered        arrangement;    -   a plurality of non-resist film portions are disposed        correspondingly to the contact pads to form a staggered        arrangement;    -   each of the non-resist film portions has a corresponding one of        the step portions.    -   (28) The circuit board according to (24) or (25), further        comprising:    -   a memory device on a second surface of the substrate opposite        from the first surface.    -   (29) The circuit board according to (25), wherein a plurality of        the dummy patterns are disposed.    -   (30) The circuit board according to (29), wherein:    -   a plurality of the contact pads are disposed to form a staggered        arrangement;    -   the plurality of the dummy patterns are disposed correspondingly        to the contact pads to form a staggered arrangement.    -   (31) The circuit board according to (24), wherein a height of        the step portion is substantially equal to a thickness of the        contact pad.    -   (32) The circuit board according to (25), wherein a height of        the step portion is substantially equal to a thickness of the        dummy pattern.    -   (33) An ink cartridge comprising:    -   an ink storing portion storing at least ink;    -   an ink supply port communicating with the ink storing portion;        and    -   the circuit board recited in any one of (24), (25), (27), (29),        (30), (31) and (32).    -   (34) The ink cartridge according to (33), further comprising:    -   a mounting portion at which the circuit board is mounted to the        ink cartridge;    -   a projecting portion located at an upstream side of the mounting        portion in the direction in which the connector terminal is        connected to the contact pad,    -   wherein the projecting portion extends beyond the contact pad.

The present disclosure relates to the subject matter contained inJapanese patent application No. 2001-229938 (filed on Jul. 30, 2002),which is expressly incorporated herein by reference in its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating the entire configuration of an inkjet type recording apparatus to which this invention is applied.

FIG. 2 is a schematic view illustrating an ink supply system includingfrom ink cartridges to a recording head.

FIG. 3 is a perspective view illustrating the configuration of afront-side part of a cartridge holder.

FIG. 4 is a view illustrating the configuration of each of opposed partsof a connection mechanism, which is disposed in the cartridge holder,and the ink cartridge.

FIG. 5 is a perspective view illustrating a terminal mechanism part ofthe connection mechanism shown in FIG. 4 by enlarging the terminalmechanism part.

FIGS. 6A and 6B (6C) are configuration views each illustrating a firstpreferred embodiment of a circuit board.

FIGS. 7A, 7B, 7C, and 7D are operation explanatory views eachillustrating an operation in the case of using the circuit board shownin FIGS. 6A and 6B (6C).

FIGS. 8A and 8B (8C) are configuration views each illustrating a secondpreferred embodiment of the circuit board.

FIG. 9 is a configuration view illustrating a third preferred embodimentof the circuit board.

FIGS. 10A and 10B (10C) are configuration views each illustrating aconventional circuit board.

FIG. 11 is an operation explanatory view illustrating an operation inthe case of using the circuit board shown in FIG. 10.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, an embodiment of this invention, which is a connectionapparatus for a circuit board according to this invention applied to anink jet type recording apparatus, is described. Referring first to FIG.1, there is shown a top view of the entire configuration of the ink jettype recording apparatus that can preferably utilize this invention. InFIG. 1, reference character 1 designates a carriage. This carriage 1 isconfigured so as to reciprocatively be moved in a longitudinal directionof a paper feed member 5 guided by a scanning guide member 4, that is, amain scanning direction, which is a direction of width of recordingpaper, through a timing belt 3 driven by a carriage motor 2. Further,although not shown in FIG. 1, an ink jet type recording head 6 (to bedescribed later) is mounted on the carriage 1.

Furthermore, subtanks 7 a to 7 d for supplying ink to the recording headare mounted on the carriage 1. In this embodiment, these subtanks 7 a to7 d are four tanks, each of which is provided in such a way as totemporarily store a corresponding kind of ink and as to correspond to acorresponding one of colors of ink (for instance, black ink, and yellowink, cyan ink, and magenta color ink).

Further, this embodiment is configured so that black ink and such kindsof color ink are supplied to these subtanks 7 a to 7 d through flexibleink supply tubes 10, . . . , 10 respectively constituting supply linesfrom ink cartridges (hereunder referred to as main tanks) 9 a to 9 dloaded in the cartridge holder, which is placed in the main unit of therecording apparatus.

On the other hand, a capping means 11 enabled to cover a nozzle orificeof a recording head is disposed at a nonprint area (or a home position)on a movement path of the carriage 1. Furthermore, a capping member 11 aformed from an elastic material, such as rubber, and enabled to seal thenozzle formation surface of the recording head the top surface of thiscapping means 11 by being brought into intimate contact therewith.Further, when the carriage 1 moves to the home position, the cappingmeans 11 moves (or rises) to the recording head, so that the nozzleformation surface of the recording head can be sealed with the cappingmember 11 a.

This cap member 11 a functions as a cap element for sealing the nozzleformation surface of the recording head during an idle period of therecording apparatus, and for preventing a nozzle opening from drying.Further, an end of a tube of a suction pump (that is, a tube pump) isconnected to this cap member 11 a. The cap member 11 a is adapted toperform a cleaning operation of causing a negative pressure, which isgenerated by the suction pump, to act upon the recording head, andsucking and discharging ink from the recording head.

Meanwhile, a wiping member 12 formed like a strip and made of an elasticmaterial, such as rubber, is placed adjacently to a print area of thecapping means 11, and configured so as to advance in a horizontaldirection to the movement path of the recording head, as occasiondemands, and wipe and clean the nozzle formation surface.

Referring next to FIG. 2, there is shown a schematic view of theconfiguration of the ink supply system mounted on the recordingapparatus illustrated in FIG. 1. This ink supply system is describedhereinbelow by referring to FIG. 2 and FIG. 1, in which the ink supplysystem is designated by the same reference character. In FIGS. 1 and 2,reference character 21 denotes an air compression pump 21. This systemis configured so that air pressurized by this air compression pump 21 issupplied to a pressure regulating valve 22, and that then, such air issupplied to each of the main tanks 9 a to 9 d (in FIG. 2, the main tanksare collectively and simply denoted by reference character 9, andhereunder, the main tanks are sometimes designated simply andgenerically by reference character 9) through a pressure sensor 23.

In this case, the system is configured so that air flow channels branchfrom the pressure sensor 23 to the main tanks 9, and that pressurizedair is applied to the main tanks loaded in the cartridge holder 8. Thepressure regulating valve 22 has a function of decompressing air andmaintaining the air pressure, which is applied to each of the main tanks9 a to 9 d, within a predetermined range when the air pressurized by theair compression pump 21 reaches an overpressurized state owing to sometrouble.

Further, the pressure sensor 23 functions in such a way as to detect theair pressure pressurized by the air compression pump 21 and as tocontrol an operation of driving the air compression pump 21. That is,when the sensor 23 detects that the air pressure pressurized by the aircompression pump 21 reaches a predetermined pressure, the sensor 23stops the operation of driving the air compression pump 21 according tothis detected fact. Conversely, when the sensor 23 detects that the airpressure pressurized by the air compression pump 23 becomes equal to orless than a predetermined pressure, the system controls the sensor 23 insuch a manner as to drive the air compression pump 21. By repeating suchoperations, the pressure sensor 23 functions in such a way as tomaintain the air pressure applied to each of the main tanks 9 a to 9 dwithin the predetermined range.

As is seen from FIG. 2 schematically showing the configuration of themain tank 9, a case constituting an outer part thereof is formed in sucha way as to be in an airtight state. An ink pack 24 made of a flexiblematerial, in which ink is contained, is accommodated in the main tank 9.Further, the main tank 9 is configured so that a space defined by themain tank 9 and the ink pack 24 constitutes a pressure chamber 25, andthat pressurized air is supplied into this pressure chamber 25 throughthe pressure sensor 23.

With this configuration, the ink pack 24 accommodated in each of themain tanks 9 a to 9 d is pressurized by the pressurized air, so that anink flow from each of the main tanks 9 a to 9 d to a corresponding oneof the subtanks 7 a to 7 d is generated by a predetermined pressure.

Incidentally, as shown in FIG. 2, a circuit board 27, on which asemiconductor storage element (a memory device) implemented by, forexample, EEPROM is mounted, is attached to a part of the case of themain tank 9 serving as an ink cartridge. For example, information on thekind (for instance, information for discriminating dye ink or pigmentedink), color, and remaining amount of ink contained in the ink cartridgeis stored in the semiconductor storage element mounted on this circuitboard 27. Further, as illustrated in FIG. 2, a terminal 28 (thiscorresponds to the contact pad 62), at which the information can be readfrom and written to the semiconductor storage element, is disposed at apart of the main tank 9, and configured so as to be able to beelectrically connected to the recording apparatus in the case that themain tank 9 is attached to the recording apparatus.

Meanwhile, the system is configured so that ink pressurized in each ofthe main tanks 9 a to 9 d is supplied to a corresponding one of thesubtanks 7 a to 7 d mounted on the carriage 1 (in FIG. 2, the subtanksare collectively designated by reference character 7, and hereunder, thetanks are sometimes denoted simply and generically by referencecharacter 7) through a corresponding one of the ink supply valve 26, . .. , 26 and a corresponding one of the ink supply tubes 10, . . . , 10.

The basic configuration of this subtank 7 is established so that a floatmember 31 is disposed therein, and that a permanent magnet 32 isattached to a part of the float member 31. Further, magnetoelectricalconversion elements 33 a and 33 b typified by Hall elements are mountedon the circuit board 34, and attached and connected to a side wall ofthe subtank 7.

With this configuration, an ink amount detecting means is constituted byincluding the float member 31, the permanent magnet 32 disposed on thefloat member 31, and output generating means for outputting anelectrical output generated by the Hall elements 33 a and 33 b accordingto a magnetic dose that is generated by the permanent magnet 32according to a position to which the float member rises.

In this embodiment, the ink amount detecting means is utilized in such away as to detect that an amount of ink contained in each of the subtanks7 reaches a predetermined amount (corresponding to an ink full state) bysupplying ink from each of the main tanks 9 to a corresponding one ofthe subtanks 7. In this case, the system is configured so that the inksupply valve 26 is closed according to the electrical output of the Hallelements 33 a and 33 b.

Further, in the case where it is detected from the electrical outputs ofthe Hall elements that opened according to the electrical outputs of theHall elements 33 a and 33 b that the amount of ink contained in thesubtank reaches an amount (corresponding to a low ink-amount state),which is equal to or less than a predetermined volume, by performing aprint operation, the system operates in such a way as to open the inksupply valve 26. Thus, the ink pressurized in each of the individualmain tanks 9 is supplied to a corresponding one of the subtanks 7, inwhich the consumption of ink progresses. Therefore, the system operatesso that ink is intermittently supplied from the main tanks to thesubtanks by repeating the operations as described above, and that ink ofan amount, which is within a predetermined range, is always stored ineach of the subtanks.

Furthermore, as illustrated in FIG. 2, the system is configured so thatink is supplied from each of the subtanks 7 to the recording head 6through the valve 35 and the tube 36 connected thereto. The systemoperates so that ink droplets are outputted from a nozzle opening 6 aformed in the nozzle formation surface of the recording head 6 accordingto print data supplied to an actuator (not shown) of the recording head6. Incidentally, in FIG. 2, reference character 11 designates thecapping means. The tube connected to this capping means 11 is alsoconnected to a suction pump (not shown).

Referring next to FIG. 3, there is shown a view of the configuration ofa front-side part of the cartridge holder 8. A cover member 41, which isopened when the main tank is attached thereto or detached therefrom, isequipped in this cartridge holder 8. That is, the system is configuredso that this cover member 41 is placed at an opening front face of thecartridge holder 8, that a turning shaft 41 a is supported by a supporthole (not shown) formed in the main unit of the recording apparatus, andthat the opening front face of the cartridge holder 8 can be opened(corresponding to a state indicated by solid lines) or closed(corresponding to a state indicated by chain lines) by turning the covermember 41 around the turning shaft 41 a.

A plurality of operating levers 42 are disposed inside the closed covermember 41 correspondingly to the main tanks 9 loaded in the cartridgeholder 8. A locking hole 42 a is formed in each of a base part of eachof these operating levers 42. Each of the operating levers 42 isturnably supported by a supporting rod inserted into the locking hole 42a formed therein.

Further, each of the main tanks 9 can be loaded or unloaded by turningthe operating levers 42 in the same direction as the direction, in whichthe cover member 41 is opened, during a state in which the cover member41 is opened. That is, when the main tank 9 is loaded into the cartridgeholder 8, the main tank 9 is inserted thereinto during the operatinglevers 42 are turned in the same direction as that in which the covermember 41 is opened. Then, the operating levers 42 are setup. Thus, apressing portion 42 b formed in each of the operating levers 42 abutsagainst a front-side end portion of a corresponding one of the maintanks 9, so that the main tanks 9 are loaded in the holder 8 accordingto the principle of leverage.

Furthermore, when the main tank 9 loaded in the holder 8 is drawn outtherefrom, the operating levers 42 are turned in the same direction asthat in which the cover member 41 is opened. Thus, although not shown inthe figure, the main tank 9 is pushed out from the back side of theholder 8 through a link rod engaged with a part of the operating levers42. Consequently, the main tank 9 pushed out in the direction of a nearside, as viewed in the figure, can be easily pulled out.

An electrical switch 43 for detecting the opening of the cover member 41is further provided in the cartridge holder 8. For example, a tactswitch is used as this switch 43 which is put into an on-state by beingin contact with the rear surface of the cover member 41 during the statein which the cover member 41 is closed, and which is put into anoff-state during the state in which the cover member 41 is opened. Thisswitch 43 is adapted to forcedly open the pressure regulating valve 22during the off-state. Thus, during each of the ink cartridges isexchanged, when the cover member 41 is opened, the switch 43 operates insuch a way as to cause the pressurized air, which is provided to each ofthe ink cartridges, to flow into the air.

FIG. 4 is a sectional view of the configuration of a connectionmechanism placed in the cartridge holder 8 and the configuration of anend portion of the main tank 9 serving as an ink cartridge. Pairedopening holes 51 each serving as a positioning means utilized whenloading the ink cartridge into the recording apparatus are formed ineach of the main tanks 9 serving as ink cartridges. Further, an inkoutlet part 50 for leading ink out of the ink pack 24 is mounted in analmost middle portion intervening between the paired positioningopening-holes 51. Further, an inlet port 52 for pressurized air, and acircuit board 27, on which a semiconductor storage element enabled toreading/writing of information on the ink cartridge is mounted, aredisposed on both outer sides of each of the opening holes 51 formed inthe two places.

Meanwhile, paired positioning pins 56 each formed like a cylinder areplaced in a connection mechanism 55 placed in the cartridge holder 8.The system is configured so that the paired positioning opening-holes 51formed in the main tank 9 are provided in such a way as to surround eachof the positioning pins 56.

Thus, the positioning opening-holes 51 are placed at two places in thecase of the main tank 9. Consequently, the three-dimensional positioningof the main tanks 9 serving as the cartridges can be achieved byattaching the two positioning pins 56, which are placed on the recordingapparatus, to the base part. A hollow ink inlet tube 57 disposed at anearly central part intervening the paired positioning pins 56 isinserted into the ink outlet part 50 for leading ink out of the ink pack24, so that the system is put into a condition in which ink can be ledout from the cartridges.

Further, an inlet port 52 for pressurized air is connected to an outletport 58 for pressurized air, which is placed in the cartridge holder 8,by loading the main tank 9 thereinto. Thus, the system is put into acondition in which pressurized air is introduced into the main tank 9.Moreover, a terminal mechanism 59 having a plurality of connectorterminals is connected to the circuit board 27 placed on the main tank9. Thus, the system is brought into a condition in which the transfer ofdata between the semiconductor storage element provided on the circuitboard 27 and the terminal can be realized.

FIG. 5 illustrates the configuration of the terminal mechanism 59, whichis taken from the back surface thereof in contrast with FIG. 4 takenfrom the opposite surface thereof. That is, FIG. 5 shows theconfiguration in which the connector terminals 70 to be electricallycontacted with the surface of the circuit board 27 placed on the maintank 9 are arranged. Each of these connector terminals 70 is formed froman elastic metal material, for example, phosphor bronze, and has seventerminals that respectively correspond to the contact pads formed on thecircuit board 27 of the main tank 9 and that are arranged in what iscalled a staggering manner.

Further, each of the end portions of the connector terminals 70 isformed like an arc. The end portions of the connector terminals 70 areconfigured so that when the connector terminals 70 are brought intorelative contact with a surface of the circuit board from a direction ofthe surface thereof, the arcuate outer peripheral surface is put intoslide contact with the circuit board surface. Thus, when the main tankis detached and attached, the frictional resistance of each of theconnector terminals 70, which is put into slide contact with the circuitboard surface, can be reduced. Further, each of the connector terminals70 are connected to a read/write circuit (not shown) mounted on therecording apparatus. Data is transferred between this circuit and thesemiconductor storage element mounted on the circuit board 27.

Meanwhile, FIGS. 6A and 6B (6C) illustrate a first preferred embodimentof the circuit board (IC chip) 27 placed on the ink cartridge serving asthe main tank 9. Further, FIG. 6A is a plan view of the circuit board,which is taken from above the top surface. FIG. 6B (6C) is an enlargedsectional view of the circuit board, which is taken from line A-A in thedirection of arrows shown in FIG. 6A. Incidentally, the basicconfiguration of this circuit board 27 is similar to the circuit boardpreviously described with reference to FIGS. 10A and 10B (10C).Therefore, the corresponding portions are designated by the samereference characters.

The circuit board 27 shown in FIGS. 6A and 6B (6C) is coated with solderresist film 63 with the exception of places, at which the contact pads62 are formed, and portions that are on the path of the connectorterminals 70 coming in slide contact with the contact pads 62 and thatare adjacent to the contact pads 62. Incidentally, the thickness of eachof the contact pads 62 is about 40 μm or so. Similarly, the thickness ofthe resist film 63 is about 40 μm or so. Hence, as illustrated in FIG.6B (6C), a no-resist-film formation part 61 a, on which resist film 63is not formed, that is, an exposed part of the circuit board base(substrate) 61 is formed as a concave part that is about 40 μm in depth.Consequently, a step portion 62 a is formed between the circuit boardsurface 61 a serving as a part, on which the resist film 63 is notformed, and the surface of each of the contact pads 62 formed frommetallic foil (for example, copper foil).

FIGS. 7A, 7B, 7C and 7D illustrate the manners, in which the connectorterminals 70 are brought into relative slide contact with the circuitboard 27 of the aforementioned configuration, in sequence. Incidentally,similarly as the semiconductor storage element of the circuit board ofthe configuration illustrated in FIG. 11, a semiconductor storageelement (memory device) 65, for example, EEPROM is mounted on the rearsurface of the circuit board 27, and electrically connected to thecontact pads 62 through circuit patterns (not shown) and through holes(not shown). Furthermore, the semiconductor element 65 is fixed onto therear surface of the circuit board 27 by a mold resin 66. Furthermore, asdescribed with reference to FIG. 11, the circuit board 27 is attached tothe ink cartridge so that the contact pads 62 are located at a leadingend portion of a case formed from a synthetic resin, which constitutesan outer part of the ink cartridge, in such a way as to place on thesurface thereof.

Incidentally, FIG. 7A illustrates an initial state in the case that theink cartridge 9 is loaded into the cartridge holder 8. Then, the processof loading the ink cartridge is performed through steps illustrated inFIGS. 7B and 7C. FIG. 7D illustrates a state in which the loading of theink cartridge 9 is completed. First, in the case that the ink cartridgeis loaded into the cartridge holder as illustrated in FIG. 7A, the endportion of the connector terminal 70 disposed on the cartridge holder 8is caused to override a projecting part 68 formed on the ink cartridge.At that time, the projecting part 68 undergoes the slide contact withthe connector terminal 70. A part of a synthetic resin materialconstituting the outer case of the cartridge is worn, and the wornmaterial becomes floury dust 71, which then adheres to the connectorterminal 70.

Subsequently, as illustrated in FIG. 7B, the connector terminal 70 comesin slide contact with the top surface of the resist film 63 formed onthe circuit board surface with the dust 71 adheres thereto. Moreover, asillustrated in FIG. 7C, the connector terminal 70 falls to the part 61a, on which no resist film is formed, provided nearest to the contactpad 62. Finally, as illustrated in FIG. 7D, the connector terminal 70undergoes elastic deformation and runs upon the top surface of thecontact pad 62, so that the connector terminal 70 comes in contact withthe contact pad 62. At that time, the dust adhering to the connectorterminal 70 is wiped by the step portion 62 a formed owing to thethickness of the contact pad 62.

Therefore, the frequency of causing the dust to intervene between thecontact pad and the connector terminal can be reduced. The reliabilityof the electrical contact between the connector terminal and the contactpad can be ensured. Further, the effect of wiping the dust adhering tothe connector terminal can be enhanced because the step portion 62 a isconstituted by metal foil that constitutes the contact pad 62.

Incidentally, in the configuration of the circuit board 27 describedwith reference to FIGS. 6A to 7D, the resist film 63 is applied on thesurface of the circuit board. However, in the case that no circuitpatterns are present on the path on which the connector terminals 70come in slide contact with the circuit board 27, the resist film 63 canbe omitted. That is, the resist film 63 serves to prevent the circuitpattern from undergoing electrical trouble by touching the connectorterminal 70. Therefore, in other words, in the case that a circuitpattern is present on the path, on which the connector terminals 70 comein slide contact with the circuit board 27, resist film may be formedonly on the part of the path where the circuit pattern is present.

FIGS. 8A and 8B (8C) illustrate a second preferred embodiment of thecircuit board 27. Further, FIG. 8A is a plan view taken from above thetop surface of the circuit board. FIG. 8B (8C) is an enlarged sectionalview taken from line B-B in a direction of arrows shown in FIG. 8A.Incidentally, the basic configuration of this circuit board 27 issimilar to the circuit board previously described with reference toFIGS. 6A and 6B (6C). Therefore, the corresponding portions are denotedby the same reference characters.

In the second example of this circuit board 27, a dummy pattern 69 madeof metallic foil is formed on the path, on which the connector terminals70 come in slide contact with the circuit board 27. This dummy pattern69 is formed on the circuit board base 61 simultaneously when thecontact pads 62 and the circuit patterns (not shown) are formed thereonby an etching process. Therefore, the dummy pattern 69 can be formed sothat the thickness thereof is nearly equal to the thickness of thecontact pad 62.

Further, in the case of this embodiment, the circuit board is coatedwith solder resist film with the exception of places, where the contactpads are formed, and positions (that is, the left-side area, as viewedin each of FIGS. 8A and 8B (8C)) that are on the slide contact path ofconnector terminals 70 and that are more front than the dummy pattern.This configuration utilizes the thickness of the dummy pattern 69 todefine a step portion 69 a that rises relative to the portion 61 a, onwhich the resist film 63 is not formed, that is, the exposed part of thecircuit board base 61.

Therefore, similarly as the step portion of the example described withreference to FIGS. 7A to 7D, the step portion 69 a performs an operationof wiping the dust adhering to the connector terminals 70. Hence, theembodiment of the configuration illustrated in FIGS. 8A and 8B (8C) canobtain operations and effects similar to those of the embodiment of theconfiguration illustrated in FIGS. 6A to 7D. Incidentally, preferably,the dummy pattern 69 is insulated from the circuit patterns (not shown)arranged on the circuit board 27. With this configuration, thesemiconductor storage element 65 mounted on the circuit board 27 can beprevented from undergoing electrical troubles when the connectorterminal 70 touches the dummy pattern 69.

Referring further to FIG. 9, there is shown a plan view of a thirdpreferred embodiment of the circuit board 27. Incidentally, even in thisFIG. 9, parts corresponding to the previously described portions aredesignated by the same reference characters. In the embodimentillustrated in this FIG. 9, the dummy patterns 69 are formed on theslide contact path of the connector terminals in such a manner as toseparate from one another correspondingly to the plural connectorterminals. Even in the case of the circuit board of this configuration,similarly as in the embodiment illustrated in FIGS. 8A and 8B (8C), astep portion 69 a corresponding to the thickness of the dummy pattern 69is formed on the exposed part 61 a of the circuit board base 61. Thisstep portion performs an operation of wiping the dust adhering to theconnector terminal 70, similarly as the embodiments already described.Thus, even in the circuit board of the configuration illustrated in FIG.9 can obtain operations and effects similar to those of the embodimentsalready described.

Incidentally, according to the configuration illustrated in FIG. 9, thedummy patterns 69 are formed on the slide contact path of the connectorterminals in such a way as to separate from one another correspondinglyto the plural connector terminals. Therefore, the connector terminals 70can be prevented from being short-circuited to one another through thedummy patterns 69 when each of the connector terminals 70 passes on thedummy pattern 69 by being put into slide contact therewith.Consequently, a read/write circuit (not shown) mounted on the recordingapparatus can be prevented from undergoing electrical troubles.

As described above, according to a circuit board of this invention, astep portion is formed on a path of a connector terminal coming intoslide contact with a circuit board having a contact pad. Thus, dustadhering to the connector terminal can be removed by the step portion.Consequently, the reliability of the electrical contact between thecontact pad and the connector terminal can be ensured.

Further, in the case where a projecting part is formed to prevent theconnector terminal from coming in contact with the end portion of thecircuit board, dust adhering to the connector terminal due to wear ofthe projecting part can be removed by the step portion.

Further, proper operation of the recording apparatus can be ensured byutilizing the connection apparatus of the invention in the ink jet typerecording apparatus configured so that a signal is transferred betweenthe main unit thereof and the circuit board mounted on the ink cartridgein the state in which the circuit board is mounted on the ink cartridge.The reliability of operations of such a kind of the ink jet typerecording apparatus can be assured.

In addition, in the arrangement (1) discussed above, the first surfaceof the substrate exposed by the non-resist film portion may have anadditional layer (a thin film, a protective layer, etc.) applied thereonas long as the non-resist film portion and the contact pad define thestep therebetween.

Similarly, in the arrangement (8) discussed above, the first surface ofthe substrate exposed by the non-resist film portion may have anadditional layer (a thin film, a protective layer, etc.) applied thereonas long as the non-resist film portion and the dummy pattern define thestep therebetween.

Similarly, in the arrangement (19) discussed above, the bottom of therecessed portion may be formed by the first surface of the substrate,and alternatively may be formed by a surface of an additional layer (athin film, a protective layer, etc.) applied on the first surface of thesubstrate.

In the arrangement (24) discussed above, the first surface forming thestep portion may be formed by a surface of a substrate base, andalternatively may be formed by an additional layer (a thin film, aprotective layer, etc.) applied on the surface of the substrate base.

In the arrangement (25) discussed above, the first surface forming thestep portion may be formed by a surface of a substrate base, andalternatively may be formed by an additional layer (a thin film, aprotective layer, etc.) applied on the surface of the substrate base.

1. (canceled)
 2. An IC chip comprising: a substrate; a contact pad on afirst surface of the substrate, and to be connected to a connectorterminal that is adapted to be come in sliding contact with the contactpad; a resist film portion on the first surface of the substrate; amemory device on a second, opposite surface of the substrate, the memorydevice being electrically connected to the contact pad; a non-resistfilm portion exposing the first surface of the substrate, wherein thenon-resist film portion and the contact pad define a step therebetween,and the step is located at least one of an upstream side and adownstream side of the contact pad in a connecting direction in whichthe connector terminal is contacted to the contact pad.
 3. The IC chipaccording to claim 2, wherein the step includes a first step and asecond step which are located at the upstream side and the downstreamside of the contact pad in the connecting direction, respectively.
 4. Acircuit board comprising: a substrate, a contact pad on a first surfaceof the substrate, and to be connected to a connector terminal that isadapted to be come in sliding contact with the contact pad; a resistfile portion on the first surface of the substrate; and a non-resistfilm portion exposing the first surface of the substrate, wherein thenon-resist film portion and the contact pad define a step therebetween;and the step down is located at least one of an upstream side and adownstream side of the contact pad in a connecting direction in whichthe connector terminal is contacted to the contact pad.
 5. The circuitboard according to claim 4, wherein the step includes a first step and asecond step which are located at the upstream side and the downstreamside of the contact pad in the connecting direction, respectively. 6.The circuit board according to claim 4, wherein the step is located atthe upstream side of the contact pad in the connecting direction.
 7. Thecircuit board according to claim 4, wherein the non-resist film portionis arranged between the contact pad and the resist film portion in theconnecting direction.
 8. The circuit board according to claim 4, whereinthe contact pad and the resist film portion are in a plane with eachother.
 9. A circuit board comprising: a substrate; a plurality ofcontact terminals on a first surface of the substrate, and to beconnected to a plurality of connector terminals that are adapted to beslid on a sliding path to contact with the contact terminals; a resistfilm portion formed on the sliding path on the first surface of thesubstrate; and a non-resist film portion adjacent to the contactterminals on the sliding path, wherein the non-resist film portion andcontact terminals define a step therebetween.
 10. A circuit boardcomprising: a substrate; a contact pad on the substrate, and to beconnected to a connector terminal that is adapted to be slid on asliding path to contact with the contact pad; a resist film portion onthe sliding path on the substrate, on which a resist film is formed; anda non-resist film portion arranged between the contact pad and theresist film portion, on which a resist film is not formed, wherein thenon-resist film portion and the contact pad define a step therebetween,and the step is located at an upstream side of the contact pas in aconnecting direction in which the connector terminal is contacted to thecontact pad.
 11. The circuit board according to claim 10, wherein thenon-resist film portion includes a through hole in which a patternconnected to the contact pad is provided.
 12. A circuit boardcomprising: a substrate; a contact pad on the substrate, and to beconnected to a connector terminal that is adapted to be slid on asliding path to contact with the contact pad; a resist film portion onthe sliding path on the substrate, on which a resist film is formed; anda non-resist film portion arranged between the contact pad and theresist-film portion, on which a resist film is not formed, wherein theresist film portion and the non-resist film portion define a steptherebetween, and the step is located at an upstream side of the contactpad in a direction in which the connector terminal is contacted to thecontact pad.
 13. The circuit board according to claim 12, wherein thenon-resist film portion includes a pattern connected to the contact pad.